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Intel Makes 22nm 3-D Tri-Gate Tech for Ivy Bridge
newy:
--- Quote from: TMRNetShark on May 06, 2011, 12:19:41 AM ---
--- Quote from: mgz on May 05, 2011, 10:58:10 PM ---
--- Quote from: TMRNetShark on May 05, 2011, 08:19:46 PM ---Good... goood... this is all working perfectly into my plan!
Oh yeah, my plan is to some day become a full on cyborg... to become one, I need Moore's Law to grow exponentially faster! I expect by 2045 that I can become fully cyberized and all thanks to corporations like Intel that will make it possible.
--- End quote ---
cuz your gay and want to have hardcore sex with men more often then your weak human body allows you to so your banking on intel
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Yeah? Well you know what? Oh wait I just lost interest in what you had to say... ::)
ON TOPIC: This will get Intel ahead of the game, but I'm wondering when this technology will hit GPUs and start lowering the amount of heat that are emitted from computers or any other technology that uses transistors. This will definitely increase usage life of CPUs... my question is, why didn't they think of this before? It seems like a simple enough concept, but I guess the technology to make such small circuits hadn't caught up yet.
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This shows that you have no idea how chip/semi conductor products are made... I advise you to shut up...
What I still remember from my apprenticeship (simplified):
- Wafer (silicon e.g.)
- dope it to create a n- or p-layer (oven process)
- mask that layer
- check for errors in the mask (generally almost every structure to be checked, how many on a 21" wafer? No idea, too many to count for a human)
- etch that masked layer (that's the important step in production)
- next layer
- rinse and repeat the steps above
And now add that new 3d structure to that process and see how complicated it's going to be. Keypoints are the mask and the etching.
EDIT: If metals are needed somewhere in the middle, add another step of phyiscal deposition (sputtering), or an insulating layer/structure by oxidizing in an oven.
EDIT: This does not include the SMD (or old THD) production.
NaRu:
--- Quote from: TMRNetShark on May 06, 2011, 12:19:41 AM ---my question is, why didn't they think of this before?
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They been working on this idea for 10 years.
kureshii:
http://www.realworldtech.com/page.cfm?ArticleID=RWT050511195446&p=2
--- Quote from: RWT ---As it stands today, Intel is roughly 18 months ahead of IBM, Global Foundries, TSMC and Samsung on their process technology.
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To answer Lupin’s question in the 2nd post.
nstgc:
Nice. In terms of features and structure AMD seems to be better, but I guess you can't compete with Intel's vastly superior fabrication technology. Now if one one of them would licences their tech to the other. Then we would be in for a real treat.
Lupin:
--- Quote from: kureshii on May 06, 2011, 11:32:00 AM ---http://www.realworldtech.com/page.cfm?ArticleID=RWT050511195446&p=2
--- Quote from: RWT ---As it stands today, Intel is roughly 18 months ahead of IBM, Global Foundries, TSMC and Samsung on their process technology.
--- End quote ---
To answer Lupin’s question in the 2nd post.
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18 months :o
Having design and fabrication in one place really works well especially when money is not a concern
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