they have to make an overhaul in their chip's layout and the socket itself to counter-act the effects of the die-shrink.
one way to go about it is making the chips longer as this creates a larger contact area than a shorter rectangle.
same with the socket, that is to change the square socket in favor for a rectangular socket.
this as an example illustration:
the right-side is a full-die haswell sample.
as noted, the heat-spread area of the longer but narrow die is larger.
and then if you ran heat-pipes across it in this configuration you could fit more heatpipes.
while fewer heatpipes(less than 5) would benefit on contact thats parallel to the die.
as an added thing to this, is to implement a heatpump on the die-contact area when
it is solderedhttp://en.wikipedia.org/wiki/Thermal_copper_pillar_bumpin this example its the chip-to-PCB contact where the heatpump acts, if they make it a chip-to-IHS as well then the overall heat dissipation rate will increase.