Discussion Forums > Technology
Starting to build my new rig, looking for opinions
kitamesume:
can't put much conclusion to it, since nobody does fin temp sensing during temperature comparisons anymore.
it should be obvious though that ivy bridge's heat dissipation should be lower, since of the first two reasons, one is most of the heat is stuck inside the die, and it's overall power consumption and TDP is much lower than sandy bridge.
if i remember correctly, heat ≠ temperature, you can't really say how much heat is produced by just saying the temperature.
Freedom Kira:
Fair point. I can't recall if the complaints were about overclocking resulting in higher temperatures or greater heat production, so that kind of makes my original point less solid.
kitamesume:
they really should go back to core+fintemp comparisons. it should be noted that even if the core temp is higher, if the fin's temp is lower then the overall heat dissipated is still lower.
Ivon:
--- Quote from: kitamesume on December 30, 2012, 07:59:16 AM ---has it ever occurred to you that the definition of "gaming PC" is simply a PC that can game?
--- End quote ---
When the poster posted 'ITX' I had no idea what that was. Looked it up and it seems to be the Intel Atom (not sure what AMD's is called) mobos.
http://en.wikipedia.org/wiki/Mini-ITX
Modern Example:
http://www.newegg.com/Product/Product.aspx?Item=N82E16813131840
They appear to have branched out the 'role' from just a simple Media Center computer attached to a TV/Projector. To a Low- to Mid- range computer.
"Gaming PC"
"A gaming computer (also gaming PC and sometimes called a gaming rig) is a personal computer that is capable of playing computationally demanding video games."
http://en.wikipedia.org/wiki/Gaming_computer
Guess I'm just old school. :(
I've never considered a computer that couldn't play a "big title" (Crysis, Skyrim, Far Cry, and the like) with the settings (excluding Shadows) set to maximum as a Gaming PC.
--- Quote from: kitamesume on December 30, 2012, 10:41:46 AM ---they really should go back to core+fintemp comparisons. it should be noted that even if the core temp is higher, if the fin's temp is lower then the overall heat dissipated is still lower.
--- End quote ---
Wouldn't the Core sensor and the CPU sensor do just that. Or at least close enough.
I have an i7-920, in a EVGA X58 Classified (Model 760) mobo, and if I install say EVGA's E-LEET software there's a Core #1,#2,#3,#4 Sensor reading, as well as, a CPU Temp reading. The Core readings are about 10c higher than the CPU Temp.
I would assume by the temps that the Core is the actual chip dies inside the CPU Case and the CPU Temp is the case.
PS: OP, you lost yet? Cause I'm getting there :P
kitamesume:
the cpu temp reading you got depends on where the sensor is located, most likely located on the IHS, its still different from case temp or HSF temps. the temp of the HSF should be the thing to be considered if you're measuring heat dissipated inside the case since the HSF itself is the one that dissipates the heat into the atmosphere and not the processor.
for one, core temps can reach as high as 80c on fully loaded processor, if that is the case on HSF temps then you wouldn't be able to touch it, try it and you get burns.
as for the entropy on the ITX, it will stay constant once the equilibrium is met, this equilibrium is met at lower temperatures with more efficient components that generates less heat, now a day's processor and graphics card does have this traits, expect haswell and the incoming refresh of kepler to be much more efficient.
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